DITEMUKAN 74 produk untuk:

"10"

Foli tembaga berlapis timah tahan korosi konduktif

Corrosion Resistant Conductive Clad Tin Plated Copper Foil Description : Tin cladded copper foil mainly solved surface unsmoothly and thickness uneven when ordinary copper foil is tinned. It has high peel strength on the laminated surface due to some special treatment. Also the whole process were done in room temperature and would not change metal structure. Structure: Material Thickness (%) Sn | Cu | Sn 3~4% | 92~94% | 3~4% Advantage : • Corrosion resistant tin clad foil •

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Tinggi kemurnian lembut 10um konduktif rol foil tembaga

High Purity Soft 10um Conductive Copper Foil Rolls Description Of The Products : Brief Information : Copper Foil is rolled from pure copper ingots, the process including purifying copper ores, make into copper cathodes, ingoting, rolling, annealing, washing, testing, slitting and packing. Our copper ores are imported from South America, which were famous for their copper mining. 110-anneal (Electrolytic Tough Pitch or ETP) dead soft. Min 99.96% CU This is high quality copper

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Lebar 650mm Gulungan Lembaran Foil Tembaga Murni Lunak

Width 650mm Pure Soft Copper Foil Sheet Roll Product Features: 1. For Electomagnetic Shielding Material 2. Low Roughness 3. Excellent Elongation Property 4. Excellent Oxidation Resistance 5. The product is up to the ROHS environmental standards Application Fields Aerospace,Medical Apparatus and Instruments,Communication System and Portable Electronic Products,etc. Data: Item Unit Requirment Test Method 10um 18um 35um 70um Basic Weight g/m2 84.6-92.6 152.0-166.4 295.6-323.6

Lebar 520mm Kemurnian Tinggi 25um Red ED Copper Foil

Width 520mm High Purity Red ED Copper Foil Features: 1. the treated foil in gray or red 2. High profile with properties suitable for FCCL 3. Grain structure of copper foil leads to high flexibility 4. Excellent etching performance 5. low profile enables to make fine circuit pattern Application: 1. Casting and lamination type FCCL 2. Super fine pattern FPC 3. Chip on flex (COF) for LED Typical properties of LP-S-B/R ED electrolytic copper foil(for FPC or inner layer of HDI)

0.006mm Perisai CCL / PCB 3oz Elektrolisit Foil Tembaga

0.006mm Shielding CCL / PCB Electrolytic Copper Foil Description: Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCBs) and lithium ion batteries. In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. Since 2002, the production value of China's printed

FCCL ED Foil Tembaga

FCCL ED Copper Foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Alloy: T2,C11000,C1100,C101,E-Cu58 Temperature: High Features: 1. the treated foil in gray or red 2. High profile with properties of LP-S-B/R suitable for FCCL 3. Grain structure of copper foil leads to high flexibility 4. Excellent etching performance 5. low profile enables to make fine circuit pattern Application: 1. Casting and lamination type FCCL 2. Super

Kekuatan Pengelupasan Tinggi Lebar 520mm C11000 Foil Tembaga Terisolasi

High Peel Strength Width 520mm C11000 Insulated Copper Foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Alloy: T2,C11000,C1100,C101,E-Cu58 Temper: H Features: 1. the treated foil in gray or red 2. High peel strength 3. Good etch ability 4. Excellent adhesion to etching resist Application: 1. Phenolic resin board 2. Epoxy board Compare between CA copper foil and ED copper foil 1. Process: rolled copper foil (Rolling process),ED

9um 12um 18um 35un 70um Ketebalan FPC ED Foil tembaga

9um 12um 18um 35un 70um Thickness FPC ED Copper Foil Prodent Feature 1. High tensile strength 2. High Elongation 3. Excellent etchability 4. Eco-friendly products and processes 5. free profile 6. the treated foil is pink Typical Application : FPC, Graphene Carrier Size detail : 1. Thickness: 9um 12um 18um 35un 70um 2. Width :200-1340mm,can be cutting as request,standard width is 1290mm 3. Sample can be supply Typical properties of Low Coarsening Reverse Treated Coppe Foil

Tape foil tembaga berlapis acrylic dua sisi untuk isolasi panas

Heat Insulation Acrylic Double Sided Copper Foil Tape Product Description Technical parameters: Name Single Sided Copper foil tape Double Sided Copper foil tape Mylar Copper foil tape Thickness(mm) 0.065/0.09 0.065/0.09 0.09-0.3 Adhesive Acrylic Acrylic Acrylic Backing Copper foil Copper foil Copper foil Color Copper Copper Copper Liner Paper Paper Paper Short-term temperature 180 180 180 Long-term temperature 120 120 120 Main Features Conductive and shielding Conductive and

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