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FPC FCCL FPCB 25μm 70μm Thin Copper Foil RA
Foil Tembaga 25um RA
,Foil Tembaga FCCL RA
,Foil Tembaga 70um RA
FPC FCCL FPCB 25μm 70μm Foil Tembaga RA Tipis
Dimensi Jarak:
Ketebalan Foil Tembaga dari 12 ~ 100µm dapat disuplai untuk FPC.
Lebar dapat dibuat sesuai dengan kebutuhan klien hingga 650mm.
Aplikasi:
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, film tipis kristal berlapis LED, FPCB.
Fitur:
Material memiliki ekstensibilitas yang lebih tinggi, dan memiliki ketahanan lentur yang tinggi serta tidak retak.
Tabel 1: FPC T2 sifat foil tembaga gulungan fleksibel tinggi (GB / T5230-2000,IPC-4562-2000)
| Barang | Satuan | Parameter | |||||
| 12μm | 18μm | 25μm | 35μm | 70μm | |||
| Massa per unit (± 5%) | g / m² | 107 | 160 | 300 | 400 | 445 | |
| Cu + Ag | % | ≥99,99 | |||||
| Melunakkan | H. | O, H. | O, H. | O, H. | O, H. | ||
| Kekasaran permukaan | Rz | μm | 0.4 | 0,5 | 0.7 | 0.74 | 0.76 |
| Daya tarik | Suhu Normal / 23 ℃ | N / mm² | ≥430 | ≥450 | ≥450 | ≥460 | ≥460 |
| Suhu Tinggi / 220 ℃ | N / mm² | ≥140 | ≥150 | ≥170 | ≥210 | ≥220 | |
| Pemanjangan | Suhu Normal / 23 ℃ | % | ≥1.5 | ≥3.0 | ≥4.0 | ≥4.2 | ≥4.5 |
| Suhu Tinggi / 220 ℃ | % | ≥8 | ≥10 | ≥18 | ≥28 | ≥30 | |
| Ketahanan Kelelahan (anil) | % | 65 | 65 | 65 | 65 | 65 | |
| Kekerasan | HV | ≤50 | |||||
| Resistivitas maksimum | Ωmm2 / m | 0,0171 | |||||
| Konduktivitas listrik | % | ≥98,3% | |||||
| Hasil uji lubang jarum | potongan / ㎡ | Area lubang jarum lebih dari 0,5 mm², 0,005 buah / ㎡ | |||||
Catatan: 1. Gambar diatas berdasarkan bahan temper H.
2. Copper Foil memiliki permukaan yang halus dan mengkilap, tanpa lapisan apapun ..
3. Metode pengujian mengikuti standar perusahaan kami.
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C1100 C1020 C1220 Transformer Strip, Foil Tembaga Tipis
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Lebar Kekuatan Kupas Tinggi 520mm C11000 Foil Tembaga Terisolasi
High Peel Strength Width 520mm C11000 Insulated Copper Foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Alloy: T2,C11000,C1100,C101,E-Cu58 Temper: H Features: 1. the treated foil in gray or red 2. High peel strength 3. Good etch ability 4. Excellent adhesion to etching resist Application: 1. Phenolic resin board 2. Epoxy board Compare between CA copper foil and ED copper foil 1. Process: rolled copper foil (Rolling process),ED
