kualitas T2 Konduktif Tembaga Foil Gulung Lembar Suhu Tinggi pabrik

T2 Konduktif Tembaga Foil Gulung Lembar Suhu Tinggi

country of origin

Cina

Brand Name

OEM

Sertifikat

ISO / SGS / RoHS

MOQ

50 kg

unit price

negotiable

payment method

L / C, T / T

Supply Capacity

550T Per Bulan

Product Details

Menyoroti:

3oz Copper Foil Sheet Roll

2oz Copper Foil Sheet Roll

3oz RA Copper Foil

Product Name: Foil Tembaga RA Presisi Tinggi

Application: Dua Lapisan FCCL

Width Range: Hingga 600mm

Shape: gulungan

Material: America Copper Ingot

Normal Weight: Sekitar 50kg per roll

Test Standard: IPC-4562

Fatigue Resistance: 65%

Electrical Conductivity: ≥98,3%

Maximum Resistivity: 0,0181Ωmm2 / m

Product Description

Detailed Specifications & Features

T2 Konduktif Suhu Tinggi Gulungan Lembaran Tembaga

Profil Produk:

Kami mengembangkan di luar sana foil tembaga yang dirawat yang memiliki profil sangat rendah, jenis foil tembaga ini paling baik untuk aplikasi frekuensi tinggi. Foil tembaga yang diolah permukaan, seperti 18um, 35um, 50um biasanya digunakan dalam konstruksi FPCB Multi-layer dan double face, Kami juga memproduksi foil tembaga ED berat, terutama untuk konstruksi FPCB arus tinggi.

Lembar Properti Mekanis:

Barang Berkualitas		Ketentuan Teknis Umum
		1 / 3oz	1 / 2oz	1oz	2oz	3oz
Kekasaran Permukaan (µm)	Permukaan Matte Rz	≤6	≤7	≤10	≤12	≤5.1
Kekuatan Kupas (kg / cm)		≥1.1	≥1.2	≥1.8	≥2.2	≥1.0
Titik Kebocoran (poin / m²)		≤5		Tidak
Kinerja Anti-Oksidasi Suhu Tinggi (180 ℃ / jam)		Tanpa Oksidasi
Toleransi Lebar (mm)	Gulungan	(+2.0,0)
	Bagian	(+ 2.0, -2.0)
Standar Tes		IPC-4562

Fitur:

Material memiliki ekstensibilitas yang lebih tinggi, dan memiliki ketahanan lentur yang tinggi serta tidak retak.

Pertunjukan:

Fleksibilitas dan ekstensibilitas tinggi
Permukaan rata dan halus
Ketahanan lelah yang baik
Sifat antioksidan yang kuat
Sifat mekanik yang baik

FPC T2 sifat foil tembaga gulungan fleksibel tinggi (IPC-6542)
Barang		Satuan	Parameter
Barang		Satuan	12μm	18μm	25μm	35μm	70μm
Massa per unit (± 5%)		g / m²	105	160	300	400	445
Cu + Ag		%	≥99,99
Melunakkan			H.	O, H.	O, H.	O, H.	O, H.
Kekasaran permukaan	Ra	μm	0.13	0.12	0.1	0,08	0,08
Kekasaran permukaan	Rz	μm	1.3	1.0	0.8	0.74	0.76
Daya tarik	Suhu Normal / 23 ℃	N / mm²	≥430	≥450	≥450	≥450	≥450
Daya tarik	Suhu Tinggi / 220 ℃	N / mm²	≥140	≥150	≥170	≥210	≥220
Pemanjangan	Suhu Normal / 23 ℃	%	≥1.5	≥3.0	≥4.0	≥4.2	≥4.5
Pemanjangan	Suhu Tinggi / 220 ℃	%	≥8	≥10	≥18	≥28	≥30
Ketahanan Kelelahan (anil)		%	65	65	65	65	65
Resistivitas maksimum		Ωmm2 / m	0,0181
Konduktivitas listrik		%	≥98,3%
Lapisan film dan perekat		Suhu Instan. 300 ℃ / 10 dtk	Film dan pasta perekat setelah transien suhu tanpa delaminasi terik.
Anti oksidasi	HT (200 ℃)	Menit	Tidak akan Mengubah Warna dalam 60 menit
Hasil uji lubang jarum		sepotong / m²	Area lubang jarum lebih dari 0,5 mm², 0,005 buah / m²

T2 Konduktif Tembaga Foil Gulung Lembar Suhu Tinggi 0

Tags:

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