fpc pcb copper foil

9um 12um 18um 35um High Density FPC PCB Copper Foil Specification: Thickness: 9µm～35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film. Features: High density, high bending resistance and good etching performance. Microstructure: Table1- Performance: Classification Unit 9μm 12μm 18μm 35μm Cu Content % ≥99.8 Area Weigth g/m2 80±3 107±3 153±5 283±7

0.006mm Shielding CCL / PCB Electrolytic Copper Foil Description: Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCBs) and lithium ion batteries. In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. Since 2002, the production value of China's printed

Electrolytic Flexible RA Copper Sheet Roll Dimension Range: Thickness Range: 12μm~100μm, Width(Max.): 600mm Performances: High flexibility and extensibility Even and smooth surface Good fatigue resistance Strong antioxidant properties Good mechanical properties Applications: Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film. Features: The material has higher extensibility, and has a high bending resistance and no crack. Table 1:FPC T2 high