"pcb conductive adhesive copper tape"
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                        Lebar 400mm PCB Pita Tembaga Perekat Konduktif Murni
                                Width 400mm PCB Pure Conductive Adhesive Copper Tape Specifications of copper foil paper : 1) Grade: c11000,C12200 2) Copper: cu min.99.90% 3) Thickness:0.018-1.2mm 4) Width: max.400mm 5) Coil weight:6.5kg/mm 6) Chemical Composition: Cu >99.90% p:0.015%-0.040% 7) Temper: O, 1/4H, 1/2H, H O : HV100 8) Electric 20°CConductivity: C11000 >97% ,C12200 >80% Grade and Manufacturing information: Chinese Grade Abroad Similar Brand International USA JAPAN UK GERMANY (ISO) (ASTM) (JIS)
                            
                                                         
                                                    
                        Ketebalan tahan panas 0,035 mm Pita foil tembaga termal
                                Heat Resistant Thickness 0.035mm Thermal Copper Foil Tape Product Description Item: Heat Resistant Tape Thermal Adhesive PCB LED Silicon Copper Foil ~ copper foil tapes uses copper foil as substrate and single sided coated with conductive acrylic adhesive. thermal conductivity copper foil tape ~ It can be divided into: self-adhesive copper foil, double side conductive copper foil tape ,single conductive copper foil tape.It has high temperature resistance ,strong adhesion
                            
                                                         
                                                    
                        Ketebalan 0,08mm Pita foil tembaga tahan air konduktif
                                Thickness 0.08mm Conductive Waterproof Copper Foil Tape Product Description The copper foil is of a low surface oxygen characteristics, can be attached to a variety of different substrates such as metal, insulating materials, etc., within a wide temperature range. Mainly used for electromagnetic shielding and antistatic, conductive copper foil on the substrate surface, combined with the metal substrate, has an excellent conductivity and electromagnetic shielding effect.It can
                            
                                                         
                                                    
                        0.08mm pita foil tembaga
                                Acrylic Adhesive Copper Foil Tape Product Description The copper foil is of a low surface oxygen characteristics, can be attached to a variety of different substrates such as metal, insulating materials, etc., within a wide temperature range. Mainly used for electromagnetic shielding and antistatic, conductive copper foil on the substrate surface, combined with the metal substrate, has an excellent conductivity and electromagnetic shielding effect.It can be divided into: self
                            
                                                         
                                                    
                        0.06mm pita foil tembaga
                                Die Cut Copper Foil Tape Technical Data: Color: Copper Carrier: Copper Foil Adhesive: Conductive Acrylic Adhesive Carrier Thickness (mm): 0.025 Total Thickness (mm): 0.06 ± 0.005 Appearance: Excellent, no oxidation Initial Tack(Steel Ball) (#): 11 Resistance(ohm/in2): <0.05 Holding Power(1kg/inch): ≥1140 180°Peeling Strength: >8 N/25.4mm Application Temperature: -20~120℃ Storage Condition: 20℃, 65% RH Product Description Details and Specifications Production name Polyimide
                            
                                                         
                                                    
                        CCL / PCB Isolasi Ketebalan 15um Pure Copper Foil
                                CCL / PCB Insulation Thickness 15um Pure Copper Foil Description CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD), High temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF). Feature Improve the consistency of battery usage group and reduce battery cost significantly. Improve the adhesion of active material and the collector, and reduce the electrode
                            
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