high density pcb copper foil

9um 12um 18um 35um High Density FPC PCB Copper Foil Specification: Thickness: 9µm～35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film. Features: High density, high bending resistance and good etching performance. Microstructure: Table1- Performance: Classification Unit 9μm 12μm 18μm 35μm Cu Content % ≥99.8 Area Weigth g/m2 80±3 107±3 153±5 283±7

C11000 PCB Copper Foil GB/TDINENASTMTU2E Cu58Cu ETPC11000 Material introduction:C11000(Cu ETP) Cu ETP is an electrolytically refined oxygen-containing copper. It has good electrical conductivity but compared with other high conductivity copper due to the high residua oxygen content of the alloy it is not suitable for processing (annealing welding etc.) and use in high temperature ( temperature greater than 370 ° C ) reducing gas. Because it is prone to hydrogen embrittlement

CCL / PCB Insulation Thickness 15um Pure Copper Foil Description CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD), High temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF). Feature Improve the consistency of battery usage group and reduce battery cost significantly. Improve the adhesion of active material and the collector, and reduce the electrode